Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulat

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Dongguan Ziitek Electronical Material and Technology Ltd.

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City: Dongguan

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Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulat

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Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulat

4.5W/mK thermal conductivity heat cured epoxy adhesive for bonding two parts of electronics Product Summary: TIE™380-45 is a one component, heat cured epoxy adhesive. It has excellent thermal ...

Product Tags:

heat resistant epoxy glue

thermally conductive potting epoxy

4.5W/MK Thermal Epoxy Glue

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