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China company supplied Good thermal conductive 4.7MHz Thermal Conductive Gap Filler Pad For CPU

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Dongguan Ziitek Electronical Material and Technology Ltd.

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China company supplied Good thermal conductive 4.7MHz Thermal Conductive Gap Filler Pad For CPU

Name: China company supplied Good thermal conductive 47MHz Thermal Conductive Gap Filler Pad For CPU
Brand: Ziitek
Price: 0.1 USD

China China company supplied Good thermal conductive 4.7MHz Thermal Conductive Gap Filler Pad For CPU wholesale

Brand Name : Ziitek

Model Number : TIF1100-07E Series

Certification : UL & RoHS

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 pcs/month

Delivery Time : 3-5 work days

Packaging Details : 24*23*12cm cantons

Thickness range : 0.020"(0.5mm)-0.200"(5.0mm)

color : green

Dielectric Constant : 4.7MHz

Dielectric Breakdown Voltage : >5500 VAC

Fire rating : 94 V0

Thermal conductivity : 1.5W/m-K

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China company supplied Good thermal conductive 4.7MHz Thermal Conductive Gap Filler Pad For CPU

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

The TIF1100-07E Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Features
> Good thermal conductive: 1.5W/mK
> Available in varies thickness
> Easy release construction
> Broad range of hardnesses available

> High tack surface reduces contact resistance
> Soft and Compressible for low stress applications
> Fiberglass reinforced for puncture, shear and tear resistance

Applications
> LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> display card

> Micro heat pipe thermal solutions
> Memory Modules

> routers

> Telecommunication hardware

> Heat pipe thermal solutions

>GPS navigation and other portable devices

>Audio and video components

Typical Properties of TIF1100-07E Series
Color	Green	Visual	Composite Thickness	Thermal Impedance @10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific Gravity	2.3 g/cc	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness range	0.020"-0.200"	ASTM C351	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	35 Shore 00	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Dielectric Breakdown Voltage	>5500 VAC	ASTM D412	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Outgassing(TML)	0.35%	ASTM E595	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	4.7MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	1.0X10" Ohm-meter	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	1.5W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

China company supplied Good thermal conductive 4.7MHz Thermal Conductive Gap Filler Pad For CPU

Advantage

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

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