Home > Silicone Thermal Pad >

1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application

Product Categories

Silicone Thermal Pad [139]
Heat Sink Thermal Pad [163]
CPU Thermal Pad [226]
Thermal Graphite Sheet [24]
Thermally Conductive Electrical Insulator [33]
PCM Phase Change Material [23]
Double Sided Thermal Tape [22]
Heat Conductive Plastic [9]
High Temperature Thermal Grease [15]
Thermally Conductive Potting Compound [9]
Thermal Epoxy Glue [9]
Thermal Conductive Silicone Adhesive [4]
Thermal Conductive Gel [23]
Shielding Absorbing Materials [22]
Silicone Foam Sheet [6]
Silicone Free Thermal Pad [12]
Most Popular Products [11]
Film Heating Element [6]

Dongguan Ziitek Electronical Material and Technology Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application

Name: 10WMK Silicone Thermal Gap Filler Thermal Pad For High Temperature Application
Brand: Ziitek
Price: 0.1 USD

China 1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application wholesale

Brand Name : Ziitek

Model Number : TIF100-10-01U Series

Certification : UL & RoHS

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 pcs/month

Delivery Time : 3-5 work days

Packaging Details : 24*23*12cm cantons

Products name : 1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application

Thickness : 0.5~5.0mm

Specific Gravity : 2.1 g/cc

Dielectric Breakdown Voltage : >5000 VAC

Thermal conductivity : 1.0W/m-K

Keywords : Silicone Thermal pad

Hardness : 27 ShoreA

Application : High Temperature Application

Contact Now

1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

The TIF100-10-01U Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TIF100-10-01U-TDS_EN_REV02-.pdf

1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application

Features
> Good thermal conductive: 1.0W/mK
> RoHS compliant
> UL recognized
> Tear resistance
> Easy release construction
> Electrically isolating
> High durability

Applications
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board

Typical Properties of TIF100-10-01U Series
Color	Dark gray	Visual
Construction &Compostion	Ceramic filled silicone elastomer	***
Specific Gravity	2.1g/cc	ASTM D297
Thickness range	0.020"(0.5mm)~0.200"(5.0mm)	ASTM C351
Hardness	27 Shore 00	ASTM 2240
Dielectric Breakdown Voltage	>5000 VAC	ASTM D412
Continuos Use Temp	-40 to 160℃	***
Outgassing(TML)	0.35%	ASTM E595
Dielectric Constant	4.5 MHz	ASTM D150
Volume Resistivity	1.0X10¹² Ohm-meter	ASTM D257
Fire rating	94 V0	equivalent UL
Thermal conductivity	1.0W/m-K	ASTM D5470

Standard Sheets Sizes:

8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.

Request adhesive on double side with "A2" suffix.

Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.

1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Product Tags:

1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application Images

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Dongguan Ziitek Electronical Material and Technology Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!

1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application

1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application

1.5W/m-K Thermal Gap Filler

27 Shore 00 Thermal Gap Filler

94 V0 Rubber Silicone Thermal Pad

1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application Images