Thermal Conductive Pad Ultra Soft 20shore00 4.0mmT For High Speed Mass Storage Drives

Ziitek TIF5160-50-11US is an extremely soft gap filling material rated at a thermal conductivity of 5.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. TIF5160-50-11US is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.

TIF500-50-11US Datasheet-REV02.pdf

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

<Good thermal conductive:5.0W/m-k

<Thickness:4.0mmT

<Moldability for complex parts

<Soft and compressible for low stress applications

<Broad range of hardnesses available

<High speed mass storage drives

<Telecommunication hardware

<Handheld portable electronics

<Set top boxes

<Audio and video components