20±5 Shore 00 high cost-effective thermal conductive gap filler for Telecommunication hardware
Company Profile
With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
TIF100-30-11US-Series-Datasheet-.pdf
TIF1100-30-11US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
Features
<Good thermal conductive:3.0W/mK
<Thickness:2.5mmT
<Hardness:20±5 Shore 00
<Colour: gray
<Fiberglass reinforced for puncture, shear and tear resistance
<Easy release construction
<Electrically isolating
Applications
<Telecommunication hardware
<Handheld portable electronics
<Semiconductor automated test equipment (ATE)
<CPU
<Audio and video components
<IT infrastructure
<GPS navigation and other portable devices
<CD-Rom, DVD-Rom cooling
Typical Properties of TIF1100-30-11US |
| Product Name | TIF1100-30-11US Series |
| Colour | gray |
| Construction & Compostion | Ceramic filled silicone elastomer |
| Specific gravity | 3.0 g/cc |
| Thickness | 2.5mmT |
| Hardness | 20±5Shore 00 |
| Dielectric constant@1MHz | 4.0 MHz |
| Continuos Use Temp | -40to 160℃ |
| Dielectric Breakdown Voltage | >5500 VAC |
| Thermal conductivity | 3.0W/mK |
| Volume Resistiviyt | 1.0*1012 Ohm-cm |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Advantage
Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.
They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.
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20±5 Shore 00 Thermal Conductive Gap Filler For Telecommunication Hardware Images
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