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Telecommunication Hardware Cpu Thermal Pad 3.0 W/Mk

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Dongguan Ziitek Electronical Material and Technology Ltd.

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Telecommunication Hardware Cpu Thermal Pad 3.0 W/Mk

Name: Telecommunication Hardware Cpu Thermal Pad 30 WMk
Brand: Ziitek
Price: 0.1 USD

China Telecommunication Hardware Cpu Thermal Pad 3.0 W/Mk wholesale

Brand Name : Ziitek

Model Number : TIF1200-30-06US thermal pad

Certification : UL

Place of Origin : China

MOQ : 1000 pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/month

Delivery Time : 3-8 work days

Packaging Details : 25*24*13cm canton

hardness : 18 shore00

KEYWORD : white silicone rubber pads

color : white

part number : TIF1200-30-06US

material : silicone

thermal conductive : 3.0W/mK

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Outstanding thermal performance Available in varies thicknesses silicone pads for LED Controller,4.5mmT

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

TIF100-30-06US.pdf

TIF1200-30-06US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.

<Good thermal conductive:3.0W/mK

<Thickness:5.0mmT

<Hardness:18 Shore 00

<Colour: white

<Easy release construction

<Electrically isolating

<High durability

Applications

<Automotive engine control units

<Telecommunication hardware

<Handheld portable electronics

<Semiconductor automated test equipment (ATE)

<CPU

<display card

Typical Properties of TIF1200-30-06US
Product Name	TIF1200-30-06US Series
Colour	white
Construction & Compostion	Ceramic filled silicone elastomer
Specific gravity	3.0 g/cc
Thickness	5.0mmT
Hardness	18 Shore 00
Dielectric constant@1MHz	4.0 MHz
Continuos Use Temp	-40to 160℃
Dielectric Breakdown Voltage	>5500 VAC
Thermal conductivity	3.0 W/mK
Volume Resistiviyt	1.0*10^{12 _Ohm-cm}

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Telecommunication Hardware Cpu Thermal Pad 3.0 W/Mk

Advantage

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

Telecommunication Hardware Cpu Thermal Pad 3.0 W/Mk

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Telecommunication Hardware Cpu Thermal Pad 3.0 W/Mk

Telecommunication Hardware Cpu Thermal Pad 3.0 W/Mk

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