low cost Outstanding thermal performance 3.0mmT thermal gap pad for SMD LED module
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.
Our vast experience allows us to assist our customers best in thermal engineering field.
We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
TIF100-50-11US-Datasheet-REV02.pdf
TIF1120-50-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
<Good thermal conductive:5.0W/mK
<Thickness:3.0mmT
<Hardness:20 Shore 00
<Colour: gray
<Moldability for complex parts
<Soft and compressible for low stress applications
<Naturally tacky needing no further adhesive coating
Applications
<Automotive engine control units
<Telecommunication hardware
<Handheld portable electronics
<Semiconductor automated test equipment (ATE)
<CPU
<display card
Typical Properties of TIF1120-50-11US |
| Product Name | TIF1120-50-11US Series |
| Colour | gray |
| Construction & Compostion | Ceramic filled silicone elastomer |
| Specific gravity | 2.9 g/cc |
| Thickness | 3.0mmT |
| Hardness | 20 Shore 00 |
| Dielectric constant@1MHz | 4.2 MHz |
| Continuos Use Temp | -40to 160℃ |
| Dielectric Breakdown Voltage | >5500 VAC |
| Thermal conductivity | 5.0 W/mK |
| Volume Resistiviyt | 1.0*1012 Ohm-cm |
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
FAQ
Q:How can we get detailed price list?
A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.
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3.0mmt 5 W Mk Thermal Gap Pad For Smd Led Module Images
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