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Silicone 3.5mmt Cpu Thermal Pad For Memory Modules

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Silicone 3.5mmt Cpu Thermal Pad For Memory Modules

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Brand Name : Ziitek

Model Number : TIF1140-50-11US thermal pad

Certification : UL

Place of Origin : China

MOQ : 1000 pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/month

Delivery Time : 3-8 work days

Packaging Details : 25*24*13cm canton

hardness : 20 shore00

Volume Resistiviyt : 1.0*1012 Ohm-cm

thermal conductive : 5.0W/mK

part number : TIF1140-50-11US

Specific gravity : 2.9 g/cc

color : gray

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High tack surface reduces contact resistance silicone pads for Memory Modules ,3.5mmT

Company Profile

With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.


TIF100-50-11US-Datasheet-REV02.pdf

TIF1140-50-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling
<Good thermal conductive:5.0W/mK
<Thickness:3.5mmT
<Hardness:20 Shore 00
<Colour: gray

<Available in varies thicknesses

<Broad range of hardnesses available

<Moldability for complex parts

Applications

<mainboard/mother board

<notebook

<power supply

<Heat pipe thermal solutions

<Memory Modules

<Mass storage devices


Typical Properties of TIF1140-50-11US
Product Name

TIF1140-50-11US Series

Colour
gray
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity

2.9 g/cc

Thickness

3.5mmT
Hardness
20 Shore 00
Dielectric constant@1MHz
4.2 MHz
Continuos Use Temp
-40to 160℃
Dielectric Breakdown Voltage
>5500 VAC
Thermal conductivity
5.0 W/mK
Volume Resistiviyt

1.0*1012 Ohm-cm

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

Silicone 3.5mmt Cpu Thermal Pad For Memory Modules

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Silicone 3.5mmt Cpu Thermal Pad For Memory Modules

FAQ

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.


Product Tags:

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