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3.2 W/Mk 20 Shore 00 Cpu Thermal Pad For It Infrastructure

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3.2 W/Mk 20 Shore 00 Cpu Thermal Pad For It Infrastructure

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Brand Name : Ziitek

Model Number : TIF1160-32-05US thermal pad

Certification : UL

Place of Origin : China

MOQ : 1000 pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/month

Delivery Time : 3-8 work days

Packaging Details : 25*24*13cm canton

Thermal conductivity : 3.2 W/m-K

Dielectric constant@1MHz : 4.0 MHz

Dielectric Breakdown Voltage : 1.0*1012 Ohm-cm

keyword : Thermal Gap Pad

Hardness : 20 Shore 00

Name : 3.2 W/mK blue Moldability for complex parts for IT infrastructure,20 Shore 00

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3.2 W/mK blue Moldability for complex parts for IT infrastructure,20 Shore 00

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.

Our vast experience allows us to assist our customers best in thermal engineering field.

We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


TIF100-32-05US-Series-Datasheet-REV02.pdf

Ziitek TIF1160-32-05US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
<Good thermal conductive:3.2W/mK
<Thickness:4.0mmT
<Hardness:20 Shore 00
<Colour: blue

<Electrically isolating

<High durability

<Good thermal conductive

Applications

<LED Power Supply

<LED Controller

<LED Ceilinglamp

<Monitoring the Power Box

<AD-DC Power Adapters

<Rainproof LED Power

Typical Properties of TIF1160-32-05US
Product Name

TIF1160-32-05US Series

Colour
blue
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity

3.0 g/cc

Thickness

4.0mmT
Hardness
20 Shore 00
Dielectric constant@1MHz
4.0 MHz
Continuos Use Temp
-40 to 160℃

Dielectric Breakdown Voltage

>5500 VAC
Thermal conductivity
3.2 W/mK
Volume Resistivity

1.0*1012 Ohm-cm


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

3.2 W/Mk 20 Shore 00 Cpu Thermal Pad For It Infrastructure


Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

3.2 W/Mk 20 Shore 00 Cpu Thermal Pad For It Infrastructure

FAQ

Q:Is there promotion price for big buyer?

A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China


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